BOND-1®
5th generation single bottle bonding system
Bond-1® est le système d’adhésion de 5e génération de Pentron® Clinical Technologies et il est reconnu pour sa facilité d’utilisation et sa simplicité. Un produit connaissant un succès clinique depuis son arrivée sur le marché en 1996, Bond-1® a reçu d’excellentes évaluations par de nombreuses études indépendantes.
TEMPSPAN®
"Dual" Resin for Crowns and Bridges
The innovative composite chemistry of TempSpan® C&B Material offers several features and benefits over traditional auto-mix provisional materials. The unique, acrylic-free, resin-based formulation of TempSpan® C&B Material provides outstanding physical properties to ensure reliable performance for both single unit restorations and multi-unit bridges.
Smart SOLUTIONS for your success!
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